[Cr:4, Lc:3, Tt:1, Lb:0]
Part 1: Optics: Reflection, Refraction and Diffraction,
Part 2: Mechanics: Elasticity, structures and
Part 3: Electronics: Capacitors, AC Circuits, Sensors and Actuators.
Part 1: Substrates and Doping, Resists,
Part 2: Thin Films Deposition methods: CVD, PVD, self-assembly Etc.
Part 3: Lithography: E-beam, Soft Lithography Contact Lithography, Thermal Lithography, Interference lithography, etc.
Part 4: Etching: Wet and Dry,
Part 5: Wafer Bonding and Integration.
Part 1: Difference in material properties and their effects on N/M-OEMS,
Part 2: Determination of material properties,
Part 3: Biomaterial Processing.
Part 1: Analog Designs,
Part 2: Mechanical Packing,
Part 3: Optical Arrangement.
Equipment’s: Hands on training on Laser engraver, Simulating a microfluidic channel, Designing a device.
i) Commercial Accelerometers, Pedometers: Capacitive,
ii) Bio N/M-OEMS,
iii) Optical-MEMS.